瓶胚高速注塑干燥系统之三

瓶胚高速注塑干燥系统之二,PET瓶胚,瓶胚高速注塑,PET干燥系统

预结晶模块是系统的预处理核心，包含低速搅拌 / 振动结晶器、热风加热器、布风板、料位传感器，核心功能是将无定形 PET 切片结晶度提升至 25%~35%，定型防粘连，同时预热切片至 140~160℃。

The pre-crystallization module is the preprocessing core of the system, including low-speed stirring/vibration crystallizer, hot air heater, air distribution plate and level sensor, and its core function is to increase the crystallinity of amorphous PET chips to 25%~35%, shape and prevent adhesion, and preheat the chips to 140~160℃ at the same time.
除湿干燥模块是系统的深度脱水核心，包含分子筛除湿机（双塔 / 转轮）、高温加热器、干燥料斗、露点传感器，可将环境空气露点降至 - 40℃~-70℃，经加热至 160~180℃后形成高温低露点干燥热风，实现切片深度脱水。
The dehumidification and drying module is the core of deep dehydration of the system, including molecular sieve dehumidifier (double tower/rotary wheel), high temperature heater, drying hopper and dew point sensor, which can reduce the dew point of ambient air to -40℃~-70℃, and form high temperature and low dew point dry hot air after heating to 160~180℃ to realize deep dehydration of chips.
密闭输送模块包含真空上料机、密闭螺旋输送机、保温料斗、锁气旋转阀，实现切片从预结晶模块到干燥模块、再到注塑机料斗的全程密闭输送，杜绝与环境湿空气接触，防止二次吸湿。
The airtight conveying module includes vacuum feeder, airtight screw conveyor, thermal insulation hopper and air lock rotary valve, which realizes the whole process airtight conveying of chips from the pre-crystallization module to the drying module and then to the injection moulding machine hopper, eliminating contact with ambient humid air and preventing secondary moisture absorption.
热风再生模块包含循环风机、再生加热器、过滤器、废风排出阀，实现分子筛的吸附 - 再生循环，双塔分子筛一用一备、转轮分子筛连续旋转，保证干燥热风的低露点持续稳定供应，同时采用余热回收设计，降低能耗。
The hot air regeneration module includes circulation fan, regeneration heater, filter and waste air discharge valve, which realizes the adsorption-regeneration cycle of the molecular sieve. The double-tower molecular sieve is for one use and one standby, and the rotary molecular sieve rotates continuously to ensure the continuous and stable supply of low dew point of dry hot air, and at the same time adopts waste heat recovery design to reduce energy consumption.
智能控制模块是系统的 “大脑”，包含工业级 PLC、7/10 寸触摸屏、温度 / 压力 / 料位 / 露点传感器、变频调速器，支持工艺参数配方化管理，可与注塑机联动，根据注塑产能自动调节干燥供料速度。
The intelligent control module is the "brain" of the system, including industrial PLC, 7/10 inch touch screen, temperature/pressure/level/dew point sensors and frequency converter, supporting formula management of process parameters, and can be interconnected with the injection moulding machine to automatically adjust the drying and feeding speed according to the injection capacity.
保温辅件模块包含聚氨酯保温层、气流扩散锥、粉尘过滤器、消音器，减少系统热损耗（热损失率＜5%），保证热风均匀穿透料层，同时过滤粉尘、降低设备运行噪音，符合车间环保要求。
The thermal insulation accessory module includes polyurethane insulation layer, air flow diffusion cone, dust filter and muffler, which reduces the heat loss of the system (heat loss rate ＜5%), ensures that the hot air penetrates the material layer evenly, and at the same time filters dust and reduces the equipment operation noise, meeting the workshop environmental protection requirements.
四、系统核心工作原理
瓶胚高速注塑干燥系统的核心工作原理是基于 PET 热结晶动力学与传质脱水原理，通过 “分级预结晶定型 + 高温低露点穿流干燥 + 闭环热风再生 + 全程密闭输送” 的连续工艺流，实现 PET 切片的深度干燥，且全程与注塑机联动，匹配高速注塑节拍。
The core working principle of the drying system for high-speed preform injection moulding is to realize the deep drying of PET chips through a continuous process flow of "graded pre-crystallization shaping + high temperature and low dew point cross-flow drying + closed-loop hot air regeneration + whole process airtight conveying" based on the PET thermal crystallization kinetics and mass transfer dehydration principle, and the whole process is interconnected with the injection moulding machine to match the high-speed injection cycle.
三机一体集成式系统为连续闭环作业，无间断供料，单批次切片干燥总时长 4~6 小时，完全适配 0.5~8t/h 的瓶胚注塑产能，其完整工作流程分 6 个核心环节，各环节无缝衔接、参数精准可控。
The three-in-one integrated system is a continuous closed-loop operation with uninterrupted feeding, and the total drying time of a single batch of chips is 4~6 hours, which is fully adapted to the preform injection capacity of 0.5~8t/h. Its complete working process is divided into 6 core links, which are seamlessly connected and the parameters are precisely controllable.
1. 原料密闭上料与预处理
常温无定形 PET 切片经真空上料机从原料仓输送至预结晶模块的进料口，通过锁气旋转阀密闭进入结晶器，料位传感器实时控制料层厚度 20~50cm，防止料层过厚导致受热不均、过薄造成热风短路。
Normal temperature amorphous PET chips are conveyed from the raw material silo to the feed inlet of the pre-crystallization module by a vacuum feeder, and enter the crystallizer hermetically through an air lock rotary valve. The level sensor controls the material layer thickness at 20~50cm in real time to prevent uneven heating due to too thick material layer and hot air short circuit due to too thin material layer.