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文章详情
PET瓶胚专用干燥机核心结构
日期：2026-10-15 01:33
浏览次数：199
摘要：PET瓶胚专用干燥机核心结构，PET瓶胚干燥机，结晶干燥机
PET瓶胚专用干燥机核心结构，PET瓶胚干燥机，结晶干燥机
三、设备核心结构与专用设计
PET 瓶胚专用干燥机围绕 **“低露点、防吸湿、精准控温、注塑联动”四大核心要求设计，三机一体集成式为行业主流，整体由预结晶模块、除湿干燥模块、密闭输送模块、热风再生模块、智能控制模块 ** 五大核心模块组成。
Designed around the four core requirements of "low dew point, moisture proof, precise temperature control and injection interconnection", the PET preform special dryer takes the three-in-one integrated type as the industry mainstream, and is composed of five core modules: pre-crystallization module, dehumidification drying module, airtight conveying module, hot air regeneration module and intelligent control module.
各模块均做瓶胚注塑专属优化设计，相比常规干燥机，强化了密闭性、保温性和参数精准性，全程实现 PET 切片无二次吸湿、无降解、干燥均匀，为瓶胚注塑提供合格原料：
Each module is optimized and designed exclusively for preform injection moulding. Compared with conventional dryers, it strengthens airtightness, thermal insulation and parameter precision, and realizes no secondary moisture absorption, no degradation and uniform drying of PET chips throughout the process to provide qualified raw materials for preform injection moulding.
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预结晶模块：含低速搅拌 / 振动结晶器、高精度布风板、热风加热器，核心功能是将无定形切片结晶度提升至 25%~35%，定型防粘连，同时预热至 140~160℃，降低后续干燥热负荷。
Pre-crystallization module: includes low-speed stirring/vibration crystallizer, high-precision air distribution plate and hot air heater. Its core function is to increase the crystallinity of amorphous chips to 25%~35%, shape and prevent adhesion, and preheat to 140~160℃ at the same time to reduce the subsequent drying heat load.
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除湿干燥模块：核心为双塔 / 转轮分子筛除湿机、高温不锈钢加热器、保温干燥料斗，可将环境空气露点降至 - 40℃~-70℃，加热至 160~180℃形成高温低露点热风，实现切片深度脱水。
Dehumidification and drying module: the core is a double-tower/rotary molecular sieve dehumidifier, high-temperature stainless steel heater and thermal insulation drying hopper, which can reduce the dew point of ambient air to -40℃~-70℃ and heat it to 160~180℃ to form high-temperature and low-dew-point hot air for deep dehydration of chips.
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密闭输送模块：含真空上料机、锁气旋转阀、保温螺旋输送机、恒温料斗，全程密闭输送，杜绝切片与环境湿空气接触，输送管道包裹聚氨酯保温层，防止切片温度骤降吸湿。
Airtight conveying module: includes vacuum feeder, air lock rotary valve, thermal insulation screw conveyor and constant temperature hopper, realizing full-process airtight conveying to prevent chips from contacting with ambient humid air. The conveying pipeline is wrapped with a polyurethane insulation layer to prevent chips from absorbing moisture due to sudden temperature drop.
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热风再生模块：含循环风机、再生加热器、余热回收换热器，实现分子筛吸附 - 再生循环，双塔分子筛一用一备、转轮分子筛连续旋转，保证低露点热风持续供应，余热回收设计降低能耗 30% 以上。
Hot air regeneration module: includes circulation fan, regeneration heater and waste heat recovery heat exchanger, realizing molecular sieve adsorption-regeneration cycle. The double-tower molecular sieve is for one use and one standby, and the rotary molecular sieve rotates continuously to ensure the continuous supply of low dew point hot air. The waste heat recovery design reduces energy consumption by more than 30%.
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智能控制模块：含工业级 PLC、7/10 寸触摸屏、高精度传感器（露点 / 温度 / 料位）、变频调速器，支持工艺参数配方化管理，可一键切换不同腔数模具参数，与注塑机联动实现自动供料，自带故障诊断与报警功能。
Intelligent control module: includes industrial PLC, 7/10 inch touch screen, high-precision sensors (dew point/temperature/level) and frequency converter, supporting formula management of process parameters, one-key switching of mould parameters with different cavity numbers, automatic feeding through interconnection with injection moulding machines, and with its own fault diagnosis and alarm functions.
